• Microprocessor-controlled temperature controller, modular design, with PID behavior and digital setpoint and actual value display
• alarm contacts, programmable
• seal-less, magnetically coupled stainless steel pump with cooling zone from OTZ and up to a maximum volume flow of 200l/min
• Stainless steel plate heat exchanger as cooling exchanger 
• Semiconductor technology (from 18 kW heating capacity)
• Volume flow/- and system pressure display
• automatic level monitoring via stainless steel float switch
• dirt trap in the cooling water inlet

• VP increased pump performance
• MK sealless pump with magnetic coupling above 200l/min
• FU frequency-controlled pump 
• SP special voltage versions
• VK increased cooling capacity
• VKK calcification-free cooling
• VA stainless steel versions 
• DA flow indicator
• D steam-heated
• HW hot water-heateddigital pressure switch for minimum/maximum pressure monitoring of the pump constant volume flow/pressure control
• customer-specific temperature control systemsmodular design and multi-circuit systems with central cooling water connections
• devices with fully automatic function (e.g. heating and cooling time specifications)
• manual mold blow-out devices
• external and return temperature sensor with temperature control and/or regulation
• Profinet, Profibus, DeviceNet, CAN bus and PC/master computer connection
• Interface communication for all common machine controls
• Special paint according to customer specifications
• Housing made of stainless steel
• Piping of all media-touching components made of stainless steel
• All devices also available without cooling as heating devices or without heating as temperature control with process heat

Product data sheet OT (PDF)